The CPU cooler LV12 is the result of extensive research and development. The engineers designed a slim and compact heat sink which avoids compatibility issues with higher RAM modules while maintaining a high performance capability. Therefore, LEPA relies on a new technique for efficient air stream conduction: Small air vents improve the air circulation inside the heat sink and increase the heat dissipation rate. The heat pipes rest directly on the CPU so that hot spots can be eliminated quickly. Due to these techniques, LEPA engineers were able to lower down the thermal resistance of the cooler to just 0.095°C/W.

LEPA includes a high-quality PWM fan with the durable “Barometric Oil-less” (BOL) bearing. Thanks to the application of self-lubricating materials, the patented technology allows for a consistently silent operation with 160,000 hours MTBF. Apart from that, you can detach the fan blades in order to clean them from dust and avoid a drop in performance. The 12cm fan comes with an automatic PWM control and three RPM modes. That way, you can adjust the RPM setting according to your individual system requirements: Silence Mode (800 – 1,500 RPM), Performance Mode (800 – 1,800 RPM) and Overclocking Mode (800 – 2,200 RPM).

The stylish matt black coating is not only upgrading the cooler optically, but also protects it from corrosion. LEPA applies a high-tech finish (“Super Thermal Conductive Coating”) which makes sure that it does not affect the thermal conductivity and cooling performance of the cooler. The quick and user-friendly mounting system supports all current Intel® and AMD® platforms.




*LPALV12-BK LV12 Black
*LPALV12-W LV12 White
* This model is end of life.


  • New Louver Heat Sink Structure

    The Louver fins with small openings ensure best possible air conduction and a quick and efficient heat transfer within the heat sink. Due to the U-Shape air stream conduction, the cooler can absorb more heat than ordinary solutions.

  • Superior Contact

    H.D.T. (Heatpipe Direct Touch) Technology ensures rapid thermal conduction and eliminates CPU hot spots.

  • Compatibility

    Slim heat sink tower design increases the RAM installation flexibility.

  • Higher Durability

    S.N.T.C (Super Nano Thermal Conductive) coating protects the heat sink from oxidation while maintaining an excellent heat transfer efficiency and extending the life expectancy of the cooler.

  • Patented APS control

    The intelligent APS (Adjustable Peak Speed) control of the fan provides 3 peak RPM settings to reach the optimal cooling performance for the individual system configuration.

  • BOL Bearing

    Barometric Oilless (BOL) Bearing for long life span and silent spinning.

  • High Performance & Silent Operation

    The sophisticated fin gap calculation ensures the perfect balance between fan speed and heat transfer efficiency.

  • Easy Installation

    The user-friendly all-in-one bracket supports all latest Intel® and AMD® sockets.


Model Name


Compatible Sockets

Intel® LGA 775/1150/1151/1155/1156/1366/2011



Heat Sink Dimension


Heat Sink Weight


Heat Pipe

4 x Ø6mm

Heat Sink Material

Copper Heat Pipes/Aluminum Fins /Coating

Thermal Resistance


Thermal Grease

Dow Corning® TC-5121

Fan Dimension

120 x 120 x 25 mm

Fan Speed


Fan Air Flow

40.7~76.6/91.6/112 CFM

Fan Static Pressure




Fan Noise


Fan Bearing Type

BOL Bearing

Fan Connector

4 pin PWM